Alpha Assembly Solutions, Mitch Holtzer
Mitch Holtzer, discusses the company's reclamation technology and a paper he presented during IPC APEX EXPO.
Alpha Assembly Solutions, Robert Wallace
New products discussion dedicated to eliminating solder voids.
American Standard Circuits, Dave Olson
American Standard Circuits strives to define the future of PCB technology.
American Standard Circuits, John Bushie
American Standard Circuits talks about the microwave market.
Arlon Electronic Materials, Brad Foster
Arlon's recently announced partnership with Doosan brings enormous benefits to all sides.
Break Free Strategies, Bob Ferguson
Bob Ferguson talks about his role in helping Eternal position its photoresist technology to compete in the North American marketplace.
Coast to Coast Circuits, Inc., Walt Stender
CEO Walt Stender talks about the company's latest technology offerings.
DuPont Elect. Matls., Jonathan Weldon
Controlled impedance lines on flex circuits with cross-hatched ground planes - what is the impact on electrical performance?
Electra Polymers, Chris Wall & Shaun Tibbals
What's driving solder mask development? Updates on formulations for direct imaging and ink-jet technologies.
Gardien, Rick Meraw
How does Gardien ensure global consistency in its quality assurance services, and how does the OnTrack ERP system contribute? Find out in this interview...
HDP User Group, Jack Fisher
Update on the Optoelectronics Project - demonstrator now built and under test at a number of leading OEMs.
HDP User Group, Jim Fuller
Sanmina's Jim Fuller gives an insight on how HDPUG shares the experience and resources of member companies to tackle projects and get results.
HDP User Group, John Davignon
John Davignon reviews the excellent work of the HDPUG (High Density Packaging User Group).
I-Connect007, Roundtable Wrap-up
IPC APEX EXPO Show Review Roundtable with Bob Neves, Andy Shaughnessy and Barry Matties.
Indium Corporation, Chris Nash
The "Avoid the Void" campaign - what are the concerns, reliability issues, and how has Indium responded with its solder paste formulations?
Indium Corporation, Eric Slezak
Eric discussed the launch of their new Project 99 wave solder process flux system which uses a comic book theme, with "villians" and "superheroes."
IPC, Anne Marie Mulvihill
IPC Director of Education talks about EDGE and the IPC's mentoring program.
IPC, Ken Schramko
Keeping the electronics industry's interests front and center during the rapid change of U.S. government policy positions.
Kyzen, Tom Forsythe
Advantages of real-time concentration monitoring, data management and access to data as aqueous cleaning moves towards Industry 4.0.
Lenthor Engineering, Matt Kan and M. Oscar Akbar
Lenthor Engineering updates rigid-flex capabilities at APEX.
MacDermid Enthone, Warren Kenzie
MacDermid Enthone positions itself to meet the needs of the electronics supply chain.
MacDermid, Don Cullen and Tom Hunsinger
Two member companies of the MacDermid Performance Solutions group explain how the end user benefits from the synergy.
MicroCraft, Jesse Ziomek
New dimensions in fine-pitch probe testing, and an integrated inkjet printing system for solder resist and legend.
Mirtec, Brian D'Amico
What's the latest in 2D and 3D AOI and SPI, and what's driving development of inspection technology.
Nordson and ACE, Peter Bierhuis Alan Cable
Peter Bierhuis and Alan Cable discuss the recent acquisition of ACE by Nordson Corporation.
Nordson, Roberta J. Foster-Smith
The latest new and improved product offerings from Nordson Asymtek.
Orbotech, Sharon Cohen
Sharon Cohen explains how Orbotech translates ideas into reality providing the imaging and inspection tools to meet the needs of next-generation interconnection density.
Production Analysis & Learning Svcs, Kathy Pulumbo
Upcoming events for the Los Angeles and Orange County chapters of SMTA.
Prototron Circuits, Russ Adams
Happy Birthday Prototron! After a birthday serenade from Kelly Dack, Russ describes the company's latest endeavors to supply their customer's needs.
San Diego PCB, Mike Creeden
Kelly Dack and Mike Creeden discuss observations from the show and a PCB designer renaissance.
Sanmina-Guadalajara-Mexico, Ing. Angel Camacho
Avoiding and eliminating residue in the soldering process (en espanol).
Schmoll & Taiyo, Thomas Kunz, Dennis Pusch, Jesse Session
Co-operation between Schmoll &Taiyo speeds the development of new solder mask formulations for DI.
Shane Stewart, Perfect Point
Changing drilling with Perfect Point drill and Jinzhou precision technology.
Taiyo America, Don Monn
A new option for heat dissipation from PCBs - thermally conductive solder resist.
Ventec Int'l Group, Mark Goodwin & Jack Pattie
The effect of current material issues on the supply chain for copper-clad laminate.
Ventec, Thomas Michels
A discussion of the integration and consolidation of Ventec's non-CCL activities, and the benefits of a high-level OEM technology team.