Real Time With... IPC APEX EXPO 2012
Video Index

Here is a listing of all the videos from this show. Click on a thumbnail or video title to view a video.
PCB
AT&S, Mark Beesley, Andreas Wippel

Coming to America
Guest Editor Stuart Hayton catches up with Mark Beesley and Andreas Wippel to learn more about their entry into the North American PCB market.
ATG Luther & Maelzer, Klaus Koziol

Automated Probe Testing in High-mix PCB Fab
Klaus Koziol, atg L&M director of sales North America, explains to Technical Editor Pete Starkey how a high-mix PCB shop can benefit from automating the probe-testing operation and experience the lights-out capability.
All Flex, David Becker

All Flex is on the Move
David Becker, vice president of sales and marketing for All Flex Flexible Circuits, is optimistic about his company's growth in 2011, as well as the new and innovative products that have driven this growth.
BBG, Greg Papandrew, Tony Scott

Bare Board Group Expands Into Canada
Bare Board Group President Greg Papandrew and new Canada Sales Director Tony Scott discuss BBG's recent opening of a Canadian office, as well as plans for the future.
Bare Board Group, Greg Papandrew

BBG Marks 10 Years; New Service Coming Soon
Guest Editor Kelly Dack congratulates BBG President and "PCB Sales Guy" Greg Papandrew on the company's 10-year anniversary, and gets Papandrew's take on the company's direction as he hints at a new service on the horizon.
CA Picard, Gary Weidner

C.A. Picard Talks AOI versus Visual Inspection
C.A. Picard's Gary Weidner discusses the pitfalls of visual/eye inspection versus automated optical inspection, particularly when it comes to pin holes, solder masks, nomenclatures, and other board defects.
Christopher Associates/MEK Europe, Matt Holzmann & Henk Biemans

Into the Fifth Dimension With MEK Europe
Matt Holzmann of Christopher Associates and Henk Biemans of MEK Europe discuss the growing AOI market, and MEK's new 5-D (2-D + 3-D) SPI product, which offers expanded functionality compared to traditional 3-D inspection tools.
Circuit Automation, Tom Meeker

Challenges of Handling, Coating Thin Materials
Circuit Automation President Tom Meeker describes how the challenges of coating and drying solder mask on large, thin panels for smartphones have been overcome, and how vacuum de-gassing improves via hole-filling yields.
Colonial Circuits, Michael Tucker

Fab and Design Speaking the Same Language
Colonial Circuits Engineering Manager talks about working with designers to give them an understanding of how boards are manufactured. He also discusses buying American whenever possible.
Conductor Analysis Tech, David L. Wolf

PCQR2 Database Marks 10 Years
David Wolf discusses the evolution of the IPC PCQR2 database and how the information is benefiting both the PCB and EMS industries. The program, which samples cross-sections of boards from a variety of suppliers, is a joint effort of IPC and Conductor Analysis Technologies. The database program recently celebrated its 10th anniversary.
DIS, Gary Sortino

High-Accuracy PCB Stackup Registration System
DIS Engineering Manager, Gary Sortino, gives Editor Ray Rasmussen an overview of the company's high-accuracy registration system for PCB lamination stackups.
DuPont, Glenn Oliver

New Hybrid Laminate for Flex Interconnection
Glenn Oliver, high-speed/high-frequency applications engineer, details some of the important benefits of DuPont's TK laminate, a Teflon-Kapton hybrid which can address the challenge of creating flexible interconnection capable of delivering both high-performance and small-radius bend applications without signal distortion.
Electra Polymers, Shaun Tibbals

Electra Polymers Brings LDI Solder Mask to US
Electra Polymers launched a new LDI solder mask at Productronica last fall, and the company recently introduced it here in the US. Sales and Marketing Director Shaun Tibbals discusses the challenges of fine-tuning LDI solder mask for various machines, as well as Electra Polymers' solid financial results for the fiscal year.
Endicott Interconnect, Mark D. Poliks, Ph.D

Endicott Interconnect's Plans for HDI
Dr. Mark Poliks, director of Reasearch and Development at Endicott Interconnect Technology, describes some of the current and emerging capabilities for high-density and high-performance electronic interconnection products that are or will soon be available at EIT.
Equipment Technologies Inc., John Pelletier

Doing the Job Properly, With Used Equipment
Equipment Technologies President John Pelletier explains to Technical Editor Pete Starkey the realities of the used equipment market and what differentiates the broker from the true rebuilder of PCB processing equipment.
Excellon Automation, Mike Sparidaens

Latest Developments in Precision Drilling
Excellon's Vice President of Sales & Marketing, Mike Sparidaens, brings Technical Editor Pete Starkey up to speed with latest developments in precision drilling, and explains why mechanical and laser techniques have particular applications for different requirements.
Flexible Circuit Technologies, Mark Finstad

Flex Tutorial Part of Updated Review of IPC 2223
Mark Finstad, senior application engineer for Flexible Circuit Technologies, highlights a few updates to the 2223 design spec and describes his involvement with the addition of a design-handy tutorial.
Gardien, Todd Kolmodin

Gardien's Quality Assurance for the PCB Industry
Todd Kolmodin, Gardien's vice president of quality, discusses how Gardien offers the highest level of quality assurance products, including embedded test centers right in their customer's factories.
Grayrock & Associates, Gray McQuarrie

1 MIL Lines and Spaces: Fact or Fiction?
If your boss tells you your facility needs to manufacture 1 mil lines and spaces, what do you need to know? In this roundtable discussion, subtractive processing, semi-additive processing, and interposers are examined. One thing agreed upon by all: Determine if there is a real need and work with the customer on design options. Bottom line: 1 mil lines and spaces are a fact, but do you really need them?
I-Connect007 and Burkle North America, Steve Gold

Catching Up with Steve
Burkle North America's Dick Crowe turns the table on Steve Gold and asks him what he's been up to over the last two years. Also discussed are the similarities between making Taylor guitars and manufacturing PCBs.
IMI Inc, Peter Bigelow

Winning Customers and Growing the Business
Peter Bigelow, president of IMI, Inc., a high-tech, high-mix PCB fabricator for military, microwave and aerospace applications focusing on leading edge technologies, targets his efforts on training his personnel to execute the quality requirements necessary to maintain customers and grow the business.
Integral Technology,Inc., Ken Parent

ZETA Targets HDI, Pad-cratering Issues
Integral Technology's President Ken Parent talks about the challenges in HDI technologies, including pad cratering issues, and how the company's fiberglass-free dielectric film, ZETA, addresses these issues as the industry moves to further miniaturization.
Integrated Process Systems, Dan Czebiniak

Bridging the Gap: Supplier and PCB Fabricator
IPS Technical Sales Manager Dan Czebiniak refers to his many years of PCB fabrication experience as he explains to Technical Editor Pete Starkey how the IPS range of wet process equipment continues to be developed to meet the critical needs of the PCB manufacturer.
Integrated Systems Tech, Gary Rockis

Visual, Hands-on Training
Gary Rockis, President and CEO of Integrated Systems Technology, shows off his newly published book, DVD and test-and-learn station that allows users to make electrical errors without "letting the smoke out" of the equipment.
Isola, Rich Pangier

Isola Introduces Four New Products
Rich Pangier, Director of OEM Marketing at Isola, discusses the company's new products being introduced at IPC APEX EXPO 2012 with Editor Ray Rasmussen.
JLP Consultants

Testing for Delamination
Guest Editor Mark Thompson spoke with Dr. Lee Parker about a new test vehicle he has come up with for testing for delamination, specifically the interface between the substrate and the copper. He explained that opposed to peel strength or tensile strength, de-lam at assembly is frequently caused by a shear effect and Dr. Parker has formulated a method for testing for this.

MacDermid, Denny Fritz

IPC Hall of Fame Award Winner Denny Fritz
Longtime IPC member Denny Fritz enjoys a conversation with Editor Ray Rasmussen at IPC APEX EXPO 2012. Fritz won the Raymond E. Pritchard Hall of Fame Award for industry service and commitment to the IPC.
Maskless Lithography, Rich Chenoweth

An Advanced Photoresist Exposure System
Maskless Lithography's new exposure unit allows extremely fine line and very fast exposure of dry film photoresist. It is compatible with all standard resists, therefore it is not necessary to use an LDI formulation. Additionally, the well-engineered and solidly built unit makes it suitable for virtually any environment. Maskless Lithography's Global VP of Sales and Marketing Rich Chenoweth takes the viewer through a full demonstration of the unit, inside and out.
MicroConnex, Wayne VanZandt

Unique Interconnection Structures at MicroConnex
Wayne VanZandt, vice president of sales and marketing for MicroConnex, profiles the company and some of its capabilities in the specialized arenas of fine line featured flexible circuits, laser drilling and plasma sputtering to make unique interconnection structures and solve unusual problems for its global customer base.
MicroCraft, Lino Sousa

Re-defining Flying Probe Testing
MicroCraft introduced their brand-new EMMA E4M6151 flying probe tester at IPC APEX EXPO. Guest Editor Pete Starkey chats with MicroCraft President Lino Sousa, who demonstrates the machine's ability to test a 36,000-test-point board in less than eight minutes.
MuTracx, Stuart Hayton

Understanding New Product Introduction
MuTracx has been in inkjet product development mode for nearly three years. With the successful installation of its first machine two weeks ago, the company is entering a new growth phase. Global Sales and Marketing Director Stuart Hayton discusses the long, strange trip that is NPI--and where his company will be headed in the near future.
Multilayer Technology, Viny Mulani

Understanding the North American PCB Market
A look at today's North American PCB market through the eyes of Multilayer Techology President Viny Mulani. Though military and medical PCBs are fueling growth, Mulani points out other factors his company must face in its quest to continue its growth trajectory--including investing in new technologies.
Nordson YESTECH, Don Miller

3D X-ray Developments and Service Award
Nordson YESTECH President Don Miller proudly displays the trophy received for service excellence, and describes to Technical Editor Pete Starkey the features of YESTECH's latest developments in automated 3D x-ray inspection.
OEM Press Systems, John Copp and Mary Quinlan

OEM Supporting Advanced Laminator Requirements
OEM President John Copp and Sales Manager Mary Quinlan describe to Technical Editor Pete Starkey the increasingly critical demands for laminators and fabricators of high-end multilayers for high-temperature capability, and precise temperature uniformity in their laminating presses.
OEM Press Systems, Sam Chang (Mandarin)

OEM Press Systems'GM from China
OEM Press Systems China GM, Sam join our interview in APEX. Sam said the market is getting better in China even in US. He sees a lot of new factories are opening in Western China. OEM Press Systems plans to improve their service in China to serve the new market.
OMG, Michael Carano

Michael Carano Weighs in on IPC
Guest Editor Mark Thompson speaks to newly re-elected IPC officer Michael Carano about his intentions for IPC. Michael discussed his consulting and what they are working on in some of the task groups, and indicated that he is also leading two classes here at IPC APEX. Having attended one of his classes many years ago, Mark Thompson explains that information Carano imparted was invaluable.
Orbotech, Ben Quarles

InSight "the in thing"
Guest interviewer Stuart Hayton speaks to Ben Quarles, Orbotech's Software Solutions Business Manager, about InSight, the latest addition to their suite of front-end products.
Orbotech, Gaby Waisman

Digital Tools Fuel Orbotech Product Development
As the industry seeks to reduce cycle times and increase yields, Orbotech has responded with a new automated optical repair system and a suite of digital tools. Orbotech West President Gaby Waisman discusses his company's 2012 IPC APEX EXPO offering with Guest Editor Steve Gold.
Ormet Circuits, James Haley

Revolutionary Thermal Pastes
Ormet Circuits Vice President James Haley discusses his company's critical products and how they can help PCB fabricators increase their technological edge.
Panasonic, Michael Cieslinski

Specs are a-Changin'
Panasonic's Michael Cieslinski, chair of the committee that recently revised IPC-9850, discusses the key changes made in the IPC-9850 standard, such as simplifying the stages and adding more components, as well as how the spec was organized for expandability for future technologies.
Rainbow, Jonathan Kennett

A Novel Imaging Technology
Jonathan Kennett describes his company's novel imaging technology, which can resolve features down to 10-micron lines and spaces on 18"x14" panels at rates up to 200 panels per hour.
Rogers Corporation, John Coonrod

Rogers: New Thermal Product Developments
Rogers Corporation's John Coonrod talks with Guest Editor Dan Beaulieu about new product development, including the company's new thermal material, and describes how his company selects new product technologies in which to invest.
Rogers Corporation, John Coonrod

Thermal Management Scenarios
Semblant, Steven Lowder

Revolutionary Nano-coating Technologies
Semblant CEO Steven Lowder brings Technical Editor Pete Starkey up-to-date with the latest developments in plasma-applied nano-coatings for PCBs and assemblies.
Taiyo America, Donald Monn

Prism Solder Mask Gets Enthusiastic Reception
Taiyo America Eastern Regional Sales Manager Don Monn tells Technical Editor Pete Starkey about the latest in liquid photoimageable solder mask. PSR-4000 PRSM, newly introduced, and of all-American origin, is available in a whole spectrum of colors and has remarkable shelf life.
Trilogy Circuits, Charles Capers

An Upswing Trend?
Guest Editor Mark Thompson speaks to Trilogy Circuits President Charles Capers about the trends and general health of the assembly industry. Trilogy is considering a number of capital expenditures this year, which is a great indicator for an upswing in the business.
Uyemura International Corporation, George Milad

ENIG and ENEPIG: Latest Processes and Standards
George Milad, Uyemura's national account manager for technology and chairman of the IPC Plating Committee, explains to Technical Editor Pete Starkey how recent improvements in ENIG chemistry have reduced process costs and eliminated black pad defects, and gives an update on IPC standards for ENIG and ENEPIG.
Uyemura, Donald E. Walsh

Solutions for Industry Issues
I-Connect007 Guest Editor Mark Thompson talks to Don Walsh about chemistry and various industry issues and solutions for ENEPIG and copper holes being plated shut.
VentecUSA, Jack Pattie, Bruce Hurley

Ventec Launches New Laminates at IPC APEX EXPO
Ventec CEO Jack Pattie explains the structure and service-oriented philosophy of the company, and VP of Sales and Marketing Bruce Hurley introduces Ventec's latest products, including a low-loss halogen-free laminate and a bendable high-thermal conductivity IMS material.
Walt Custer, Custer Consulting

Market Outlook
Industry market guru Walt Custer offers his insight into the markets for electronic products. Turmoil around the globe has some markets in decline or flat while others, driven by certain segments, are growing. Download the slides Walt refers to in this interview here.
EMS
3M , Matt Bosway

3M Static Management Provides Many Benefits
Matt Bosway explains to Technical Editor Pete Starkey the features and benefits of the 3M Static Management Program.
ASM Assembly Systems, Jeff Timms, Mark Ogden

"Simplify" is the Keyword in a Complex Process
ASM CEO Jeff Timms discusses trends in surface-mount assembly and explains to Technical Editor Pete Starkey how new tools and features address the increasing complexity of the process. Marketing and Sales Support Manager Mark Ogden describes how the right hardware and software can simplify the process from the operator's standpoint.
Aegis Software, Jason Spera

Jason Spera CEO of Aegis Software
Jason Spera chats with Guest Editor Mark Thompson about the 'InForce' hardware system, featuring paired conveyor locking. He also discusses the benefits to all industries of the Imonitor turn-key stand alone.
Apex Factory Automation, Matthew Conway

Newcomer Makes Waves in San Diego
Apex Factory Automation is new to our industry, and a first-time exhibitor at this year's show. Yet, they've sold all the equipment they brought to San Diego. Director of Program Development Matthew Conway explains why the company is making waves.
Ascentech, Randy Allinson

Ascentech Unveils Large-Format Cleaning Machine
Randy Allinson offers Guest Editor Steve Gold a look at his company's new Gen3 cleaning machine, a large-format, quick regenerating piece of equipment attracting attention at this year's IPC APEX EXPO.
Assembleon, Leo van de Vall

New Products and Services from Assembleon
Assembleon is introducing the iFlex and the AX Hybrid to the North American market at IPC APEX EXPO. Leo van de Vall of Assembleon also discusses a new service that uses the statistics and data generated during production to make the customer more competitive in the marketplace.
Assembleon, Mark Maas

New Pick-and-Place Equipment from Assembleon
Assembleon is introducing new pick-and-place equipment offering unique flexibility features. Mark Maas relates to Guest Editor Dr. Jennie S. Hwang how the company takes pride in its focus on consistently providing value to customers.
Blackfox, Al Dill

Blackfox Launches Training Program for U.S. Vets
Education is a big political issue this election year and Blackfox President Al Dill is part of the solution--offering training for U.S. veterans seeking employment after service. Dill also tells Guest Editor Steve Gold about other training activities and offers his perspective on this year's exhibition.
Burton Industries, Gary Burnett

Burton Industries Focuses on Customers
Burton Industries CEO Gary Burnett profiles his customer-oriented company and its capabilities.
Christopher Associates, Matt Holzmann

Competing in the Inspection Market
The assembly inspection market is often viewed as a "necessary evil." Yet, the right equipment can help increase yields. Christopher Associates President Matt Holzmann weighs in on how value can be added to this very important process.
Cisco Systems, Anurag Bansal

Pad Cratering: Solved at Last!
Cisco's Anurag Bansal, author of this year's Best USA Paper at the IPC APEX EXPO technical conference, discusses the paper with Guest Editor Stuart Hayton. A long-standing problem has been solved at last, and this is huge news for the industry!
DEK USA, Brian Smith

Intelligent Feedback Improves Print Quality
Brian Smith, DEK USA's general manager for electronic assembly, explains how the ProDEK system closes the loop on solder paste inspection, feeding intelligent information back to the printer to continuously improve print quality and precision.
Digicom Electronics, Mo Ohady

Digicom Electronics: Focus on Quality
Mo Ohady speaks with Guest Editor Bob Neves about Digicom Electronics' activity in the EMS business. The company's focus on quality and front-end work with customers is what sets them apart and their focus on domestic high-end manufacturing has contributed to their ongoing success.
EPTAC, Brian Downes

Increased Demand for Training Fuels Growth
EPTAC is a New Hampshire-based training center that is experiencing strong growth. Director of Business Development Brian Downes explains how the heavy demand for training is fueling his company's success.
EPTAC, Leo Lambert

EPTAC Updates on New Soldering Assembly Specs
EPTAC's Vice President and Technical Director Leo Lambert, who is also the chair of the IPC Assembly and Joining Committee, discusses the progress being made in the soldering assembly specifications, as well as the new documentation being released. He also touches on the soldering competition at this year's show.
Essemtec, Florian Schildein and Steve Pollock

Customer Dedication
Senior Essemtec executives Florian Schildein and Steve Pollock profile their company and describe their business emphasis, highlighting the company's dedication to providing turnkey solutions and training for their customers.
Flextronics, Murad Kurwa

Flextronics Meeting SI Needs for Customers
Vice President of Flextronics' Advanced Engineering Group, Murad Kurwa, profiles the functions and operational objectives of his group, which include new and evolving services in the area of signal integrity analysis and verification, in the company's ongoing effort to better serve customer needs.
GEN 3 Systems UK, Graham Naisbitt

A MUST Use System
Graham Naisbitt of GEN 3 Systems UK joins Guest Editor Mark Thompson to discuss his company's MUST system, which uses force testing for traceability of solder leads. An especially important feature for determining counterfeit parts.
H-Technologies Group, Dr. Jennie S. Hwang

Board-Level Defects Examined
Dr. Jennie S. Hwang discusses key issues related to board-level defects, such as pad cratering, conductive anode filament formation (CAF), and solderability defects. She also notes that lead-free assembly has placed significant stress on printed wiring board assemblies and discusses packaging trends such as BTC.
Henkel, Doug Dixon

Henkel Provides Industry Trends Update
Doug Dixon talks about industry trends and what Henkel is doing to address them. He also touches on the well-known Loctite brand, and what they are doing to keep it fresh. Henkel has new state-of-the-art, non-conductive dispensing, and Doug explains the difference between non-conductive and traditional technologies.
Hunter Technology, Joe O'Neil

Hunter Acquisition Broadens its RF Reach
Joe O'Neil, president and CEO of Hunter Technology, discusses his company's recent acquisition of Spinnaker Microwave. This acquisition broadens Hunter's reach into the high-frequency marketplace. This is an ideal fit for Hunter as a complete turnkey provider of high-performance circuit technology, including design, PCB fabrication and circuit board assembly.
Hunter Technology, Ron Rocha

Ron Rocha Discusses Lean Manufacturing
Ron Rocha, COO of Hunter Technology, discusses the challenges of a high-mix, low-volume PCB fabrication operation. Hunter may be manufacturing as many as one hundred different part numbers in any one week. Materials management and varying customer requirements mandate diligence with regard to inventory and shelf life of those materials. Wet processes must also be addressed.
Imagineering, Khurrum Dhanji

Adding Value in the EMS World
Imagineering Vice President Khurrum Dhanji chats with Guest Editor Stuart Hayton about exciting new developments and recent investment in their EMS business.
Indium Corp., Dr. Ron Lasky

Lead-Free Assembly: Can We Achieve Consensus?
Dr. Ron Lasky, senior technologist with Indium, discusses with Technical Editor Pete Starkey whether it will ever be possible to reach a consensus on lead-free assembly. He also comments on some practical benefits and explores some reliability issues.
Indium Corp., Ning-Cheng Lee

Into the Future of Solder Materials
Ning-Cheng Lee of Indium and Guest Editor Jennie Hwang discuss lead-free solder development at Indium, as well as the future requirements of lead-free materials.
JTAG Technologies, Anthony Sparks

New Revolutionary Test Tools from JTag
JTAG Technologies has introduced several new and exciting test tools. Anthony Sparks from JTAG's marketing department discusses these new tools.
Koh Young, Bill Astle

Koh Young Meeting Advanced Packaging Needs
Guest Editor Mark Thompson spoke with Bill Astle about Koh Young's AOI and SPI system, including the company's advanced packaging for flip chip and closed loop feedback between SPI and screen printing units.
KuperTek, Brendan Hogan

Focus on Emerging Technologies
KuperTek CEO Brendan Hogan discusses emerging imaging technologies with Technical Editor Pete Starkey, and he explains the characteristics of an LED-based direct imaging system using digital micro-mirror techniques.
Kyzen, Debbie Carboni

Kyzen Solution Cleans Water Soluble Fluxes
Kyzen's Debbie Carboni discusses some of the emerging trends in larger packages and LCC devices, and points out why, in the higher-temperature environment, it is important to clean out those water soluble fluxes.
LPKF, Ahne Oosterhof

State-of-the-Art in Laser Cut Stencils
Ahne Oosterhof of LPKF describes how laser-cutting techniques and material technology have been developed and improved to enable the demands of high-precision solder paste printing to be realized.
LaserJob, Carmina Lantzsch

Nano Coating Helps Control Stencil Release
Carmina Lantzsch, manager of technical support for LaserJob GmbH, describes their work developing a proprietary nano-coating that aids the stencil release process.
Lightspeed Mfg., Rich Breault

An EMS Success Story
Guest interviewer Stuart Hayton learns about exciting growth for a North American EMS provider and how this is leading to significant new investment in capital equipment.
MVP Services Corp., Jessica Paola Ver Steeg & Kelly McNulty

Chatting with the Ladies of APEX!
Guest Editor Kelly Dack worked his way into the "Women in Electronics" networking session to find out what really goes on in there! He was quickly detained, but not before snapping a few pics and convincing attendees Jessica Ver Steeg and Kelly McNulty to offer their perspective of the session on cam. Their company, MVP Services Corp is a local, female-owned business, offering contract assembly services to the world!
Manncorp, Hank Mann

Turnkey Solutions for SMT Assembly at Manncorp
Manncorp's Hank Mann reflects upon the long history of his company in supporting the needs of SMT assemblers, and describes some of the broad range of equipment that is currently attracting close attention.
Mentor Graphics - Valor Division, Henry Jurgens

Valor Cuts Waste with Lean Materials Management
Valor Product Marketing Manager Dr. Henry Jurgens gives Technical Editor Pete Starkey a view of materials management, a critical consideration when more than 80% of assembly costs are based on materials. He also explains how Lean materials management eliminates waste on the production floor.
Mentor Graphics - Valor Division, Mark Laing

Valor Automates Product Planning With New Module
Mark Laing explains why Mentor's Valor division decided to release the new Product Planning Module, and he discusses some of the common production challenges this module addresses.
Mentor Graphics, Bernard Sutton

Mentor Tools: Catching and Preventing Defects
Bernard Sutton of Mentor Graphics explains how the company's DFM software can catch - and often prevent - manufacturing defects.
Mentor Graphics, Michael Ford

Manufacturing Process Software Solutions at Mentor
Michael Ford of Mentor Graphics explains his company's new MSS software solution that streamlines and greatly improves the efficiency of the manufacturing process to achieve higher profits. The software is also scalable and suitable for any size company.
Murray Percival, Mark Percival

Adding Value as a Manufacturer's Rep
Guest Editor Stuart Hayton learns how Murray Percival brings added value to their clients and how the market has demanded changes from this manufacturer's rep.
Mydata, Nico Coenen

Using Jet Printers to Apply Solder Paste
An evolving North American assembly market is starting to embrace the benefits of losing stencils and using jet printers. Popular in Europe, these printers can actually take cost out of the assembly process. Global Sales Director Nico Coenen explains how.
Nordson Asymtek, Peter Bierhuis

Nordson Asymtek on Precision Dispensing
The last time Peter Bierhuis spoke with Real Time with... and Technical Editor Pete Starkey he was President of Nordson MARCH. Now President of Nordson ASYMTEK, Bierhuis gives his view on the company and how it addresses the market for precision dispensing, both technical and geographic.
Nordson Asymtek, Roberta Foster-Smith

Dip, Drip, Spray, and more!
Guest Editor Kelly Dack speaks with Roberta Foster-Smith, manager of Global Communications for Nordson Asymtek, about the world of fluid dispensing technology and the machinery that makes it happen.
Nordson Dage, Keith Bryant

Non-Destructive Testing with Nordson Dage
Keith Bryant, global sales director of Nordson Dage, discusses the company's new X-Plane system, which can eliminate the need for destroying a PCB in order to get accurate test information. Keith explains how this tool can pay for itself quickly, especially if the test board is an expensive, high-tech PCB.
OK International, Gary Stoffer

OKI Launching Scorpion Rework System
Ok International Director of Global Marketing, Gary Stoffer, introduces Technical Editor Pete Starkey to some of the unique features of the Scorpion Advanced Package Rework System, just launched at APEX EXPO 2012.
Ovation Products, Mark Briant

Locking Quality into Your Process
Ovation Products Sales Manager Mark Briant reveals to Guest Editor Kelly Dack how his company has fared during the recent economic downturn and credits the company's innovative products for their success.
P. Kay Metal, Dan Feinberg, Larry Kay

Dredging Through the Dross With MS2
PK Metal has a renowned history of helping those who use soldering processes clean and reuse their dross. President Larry Kay and Vice President Dan Feinberg explain how their products rejuvenate metal considered waste by some.
P. Kay Metal, Inc., Octavio Raygoza

Philips Lighting Highlights Working with P. Kay
P. Kay Metal Inc.'s Octavio Raygoza talks to Salvador Altamirano of Philips Lighting, one of their key customers in Tijuana, Mexico, about his impressions of the show as well as some of the important benefits, such as customer support, of working with P. Kay Metal.
Pemtron, Steven Wongsonvanee

Measuring Solder Paste Depositon in 3-D
Guest Editor Kelly Dack visits the Pemtron booth and gets a rundown on its TROI series equipment from Steve Wongsonvanee, Pemtron’s general manager for the Americas. Steven shows off the TROI 5700, a dual-projection, 3D system that catches solder deposition defects and displays them in graphic color.
Photo Stencil, Rachel Miller-Short

Beating Fine-Pitch Solder Paste Challenges
The printing of solder paste becomes an increasingly challenging operation as component geometries become finer and denser. Rachel Miller-Short explains how Photo Stencil continues to refine its design and manufacturing capabilities to offer a comprehensive service to its customers.
Photo Stencil, William E. Coleman

Stencil Design Guidelines Update
Dr. William Coleman, recent recipient of the IPC's President's Award, talks to guest editor Kelly Dack about the history of the IPC-7525 stencil design guidelines spec, what is included and how it has recently changed with the times.
Purdue University, Carol Handwerker

Reaching Real-World Sustainability
Guest Editor Stuart Hayton chats with Professor Carol Handwerker about the role education can play in bringing real-world manufacturing and sustainability together.
Ray Prasad Consulting, Ray Prasad

Ray Prasad on IPC-7095
Ray Prasad, chairman of IPC-7095 for the BGA design and assembly, discusses defects and thermal issues associated with high-temp materials, his background with Boeing, and specific SMT defects and their causes.
Rehm Thermal Sys., Technica, USA, Michael Hanke, Frank Medina

Rehm, Technica Partner to Expand in the U.S.
Frank Medina of Technica and Michael Hanke of Rehm Thermal Systems talk to I-Connect007 Guest Editor Michael Carano about their partnership, equipment and materials technologies, and strategies to be successful in an up-and-down market.
Rehm Thermal Systems, Helmut Öttl

Addressing Soldering Issues
Rehm Thermal Systems' Helmut Öttl sits down with Guest Editor Steve Gold on the IPC APEX EXPO show floor to examine the many misconceptions concerning the soldering process.
Rehm Thermal Systems, Michael Hanke

Rehm Thermal Systems, Technica Partner in U.S
Rehm Thermal Systems has entered into a new U.S. distribution agreement with Technica. Chief Customer Officer Michael Hanke discusses his company's new partnership, and also delves into the family-owned business's focus on process technology and global manufacturing strategy.
SIFO Technology, Craig Pynn

Overseas Parts Testing With SIFO Technology
Craig Pynn of SIFO Technology discusses the infrastructure they provide for testing of parts overseas, specifically China. SIFO offers inclusive services for in-circuit test; in a sense, they are akin to the cavalry coming to the rescue.
Saturn Electronics, Perry Sutariya

Saturn Alleviates Reliability Concerns
Saturn Electronics' Vice President Perry Sutariya discusses high-reliability concerns of EMS buyers with Guest Editor Steve Gold. Sutariya also explains how his company is working toward eliminating reliability issues even beyond IPC specifications.
ScanCAD International, Bill Loving

Simplifying Complex Technology
ScanCAD International President Bill Loving explains to Technical Editor Pete Starkey how a philosophy of "simplifying complex technology" can lead to dramatic yield improvements, taking as an example the adjustment of a stencil design to properly fit the as-received PCB.
Sensible Micro Corporation, Chris Torrioni

Are There Fake Parts in Everything?
A recent study discovered that 40% of components supplied to the US government were either substandard or fake. Guest Editor Stuart Hayton chats with Sensible Micro President Christopher Torrioni about how the introduction of the NDAA 2012 will help phase out the fakes.
Shea Engineering Services, Chrys Shea

Chrys Shea on the Challenges of Lead-Free
Chrys Shea discusses the many challenges that lead-free assembly has presented to the electronics industry, including issues from the early days of lead free that were not anticipated: copper dissolution, assembly issues with BTC (bottom side terminations) and pad cratering. Exciting developments in optical inspection are also discussed.
Smart Sonic, Bill Schreiber

Staying Green When You Clean
Bill Schreiber, president of Smart Sonic, describes some challenges involving cleaning pallets and stencils, their proprietary chemistry and their womb-to-tomb turnkey process for cleaning, while keeping the environment in mind.
Totech Super Dry, Jos Brehler

Is Oven Baking Really the Answer?
Jos Brehler, sales director of Totech Super Dry, explains how moisture-sensitive device control has become an increasingly serious issue, and the low-temperature alternatives to traditional oven baking.
Tradeos.com, Zvi Schreiber

Purchasing Circuit Boards Online
Purchasing PCBs can be a long, complicated process. A brand new website offers a way of purchasing circuit boards online, Orbitz-style. Find out more about this new site as CEO Zvi Schreiber sits down with Guest Editor Steve Gold.
TriQuint Semiconductor, John Sharp

GaAs Semiconductors vis a vis REACh and CLP
Gallium Arsenide (GaAs) semiconductors are vital in today's electronics products, especially where very high-frequency electrical signals are required. A most important application is in mobile phones. There is a concern that the EU's REACh and CLP laws may enact restrictions that will affect GaAs unfairly, as these laws may not be based on science. Sharp and his associates are working with the EU to correct this fault and he discusses these efforts with Guest Editor Dr. Ron Lasky.
Universal Instruments, Martin Anselm

Universal Instruments: AREA Consortium
Martin Anselm of Universal Instruments explains to Guest Editor Kelly Dack the company's AREA consortium. Set up within their Advanced Process Lab, the union defines their customer base and service.
Zestron, Sal Sparacino, Umut Tosun

Latest Developments in Aqueous Flux Removal
Zestron launched two new flux removal products at IPC APEX EXPO. Technical Marketing Manager Sal Sparacino, and Application Technology Manager Umut Tosun explain their characteristics and benefits to Technical Editor Pete Starkey.
Zollner, John Burke

Zollner's New Facility to Focus on the Customer
John Burke, General Manager and COO of Zollner's newly-dedicated U.S. operations located in the Silicon Valley, joins Guest Editor Joe Fjelstad to profile the new facility, its capabilities, and near-term plans for growth in service to the company's many U.S.-based customers.
iNEMI, Bill Bader

iNEMI Update with CEO Bill Bader
iNEMI initiatives continue to help pull the industry forward. Projects focused on medical electronics, miniaturization, and the environment lead the organization's efforts in 2012 along with continued roadmapping efforts.
Design
DfR Solutions, Cheryl Tulkoff

The Realities of DFM
Cheryl Tulkoff discusses with Technical Editor Pete Starkey some of the realities of design for manufacturing and reliability. She also highlights the benefits of asking the right questions before committing to design, rather than resolving the consequences of failure.
FTG Circuits, Gary Ferrari

Gary Ferrari Updates IPC-2221 Design Standard
Gary Ferrari, Director of Technical Support at FTG Circuits and Designers Council member, speaks with Guest Editor Bob Neves about the activities of the Council and the upcoming revision to the IPC-2221 Design Standard.
Intercept Technology, Dale Hanzelka

Intercept's Design Software Moving Into 3-D
Intercept Technology recently revamped the GUI of their Pantheon design suite. North American Sales Director Dale Hanzelka chats with Editor Andy Shaughnessy about the new interface, the challenges their customers are facing, and the drivers behind Intercept's journey into the third dimension.
Mentor Graphics, Michael Ford

Mentor Takes DFM to the Next Level
Michael Ford of Mentor Graphics discusses the DFM paper he presented at IPC APEX EXPO, and Mentor's move to unite the entire process, from design through final assembly.
Minco, Nick Koop

Flexible Materials and Methodologies
Stackup and plating challenges, pure-flex HDI, hybrid flex materials! Guest Editor Kelly Dack talks flex with Nick Koop, product marketing manager for Minco's flex circuit business unit.
Polar Instruments, Ken Taylor

Polar Enhances its Impedance Test System
Polar Instruments' Ken Taylor chats with Guest Editor Mark Thompson about the company's Controlled Impedance Test System and Polar's outlook for the future.
Featured
AT&S, Mark Beesley, Andreas Wippel

Coming to America
Guest Editor Stuart Hayton catches up with Mark Beesley and Andreas Wippel to learn more about their entry into the North American PCB market.
Aegis Software, Jason Spera

Jason Spera CEO of Aegis Software
Jason Spera chats with Guest Editor Mark Thompson about the 'InForce' hardware system, featuring paired conveyor locking. He also discusses the benefits to all industries of the Imonitor turn-key stand alone.
Alberi EcoTech, Krista Crotty

IPC 2-18 Committee Supplier Declarations
Krista Crotty, Chief EcoGeek of Alberi EcoTech, discusses the 2-18 committee and its activities involving supplier declaration standards. Krista explains the need for standards to assist companies with meeting the requirements of product environmental compliance.
Andy Shaughnessy, Kelly Dack and Mark Thompson

IPC APEX EXPO Post-Show Wrap-up
In this post-show wrap-up, Editors Andy Shaughnessy, Mark Thompson and Kelly Dack discuss the successful switch of IPC APEX EXPO from Las Vegas to San Diego, the conference classes and some of the coolest new technologies they've seen during the show. Plus, learn why they're renting an even bigger sailboat next year.
Assembleon, Mark Maas

New Pick-and-Place Equipment from Assembleon
Assembleon is introducing new pick-and-place equipment offering unique flexibility features. Mark Maas relates to Guest Editor Dr. Jennie S. Hwang how the company takes pride in its focus on consistently providing value to customers.
Bare Board Group, Greg Papandrew

BBG Marks 10 Years; New Service Coming Soon
Guest Editor Kelly Dack congratulates BBG President and "PCB Sales Guy" Greg Papandrew on the company's 10-year anniversary, and gets Papandrew's take on the company's direction as he hints at a new service on the horizon.
Blake Stevens, HZO

Watch This HZO Waterproof iPhone Demonstration
HZO, a startup based in Utah, has created a cool new nano-coating called WaterBlock that can protect electronic devices from water damage. Watch as R&D Director Blake Stevens drops his iPhone in a bowl of water; the Taylor Swift video keeps playing the entire time.
Circuit Automation, Tom Meeker

Challenges of Handling, Coating Thin Materials
Circuit Automation President Tom Meeker describes how the challenges of coating and drying solder mask on large, thin panels for smartphones have been overcome, and how vacuum de-gassing improves via hole-filling yields.
Conductive Compounds, Don Banfield

Printed Electronics Steering Committee Update
Don Banfield is the right person to lead the IPC Printed Electronics Steering Committee. He has been active in the field since the 1980s and has observed first-hand the hype and reality of PEC. As the chairman of the committee, he has staffed it with the individuals who can provide the structure to establish IPC as a leader in the development of the printed electronics ecosystem.
Conductor Analysis Tech, David L. Wolf

PCQR2 Database Marks 10 Years
David Wolf discusses the evolution of the IPC PCQR2 database and how the information is benefiting both the PCB and EMS industries. The program, which samples cross-sections of boards from a variety of suppliers, is a joint effort of IPC and Conductor Analysis Technologies. The database program recently celebrated its 10th anniversary.
DEK USA, Brian Smith

Intelligent Feedback Improves Print Quality
Brian Smith, DEK USA's general manager for electronic assembly, explains how the ProDEK system closes the loop on solder paste inspection, feeding intelligent information back to the printer to continuously improve print quality and precision.
EE Technologies, Clay McElhany, Sonny Newman

Printed Circuit Boards without Borders
Special Events Editor Kelly Dack sits down to chat with EE Technologies President Sonny Newman and Director of Operations Clay McElhany. They discuss the company, their customers and their creativity in providing contract manufacturing by utilizing operations located in both Northern Nevada and Mexico.
Equipment Technologies Inc., John Pelletier

Doing the Job Properly, With Used Equipment
Equipment Technologies President John Pelletier explains to Technical Editor Pete Starkey the realities of the used equipment market and what differentiates the broker from the true rebuilder of PCB processing equipment.
Four Agreements at Work, David Dibble

The Four Leadership Agreements
Does the quest for profit blind our leaders to what really keeps companies growing? Industry management guru David Dibble offers a new perspective--new agreements--on leadership. Find out how embracing four ideals can help your company reinvigorate its leadership.
I-Connect007, Mark Thompson

We're Looking for a Few Good Guest Editors
Guest Editor and PCBDesign007 columnist Mark Thompson explains how much he's benefited from being a guest editor for I-Connect007 Real Time events. If you're interested in being a guest editor, and you think you can work well in front of the camera, we'd love to hear from you.
I-Connect007, Steve Gold

Real Time with...IPC's Free iPad Winners Picked
Real Time with...IPC's sponsors are the most generous companies in the industry, giving iPads to numerous lucky attendees. Watch as Steve "Seacrest" Gold notifies some of the lucky winners--and find out what service excellence really means!
IPC Gvmt. Relations, Bhawnesh Mathur & Fern Abrams

IPC Addresses Conflict Minerals
IPC Board and Government Relations Committee member Bhawnesh Mathur and IPC's Fern Abrams talk about the issues facing the industry regarding conflict minerals.
IPC, Jack Fisher

New IPC Roadmap Reflects Current Challenges
Jack Fisher, Chairman of the IPC Roadmap, joins Editor Andy Shaughnessy to discuss the latest version of the IPC Roadmap. The updated document, available now, features expanded sections on technologies such as embedded passives.
IPC, Steve Pudles

New IPC Board Chair Sets Sights on Future
Steve Pudles, CEO of Spectral Response, is the new chairman of the IPC Board of Directors. Steve has served the IPC in a variety of volunteer positions. His goals as chairman are to expand membership in IPC and continue to foster IPC standards throughout the electronics industry. Currently, the IPC Board is interviewing candidates for president of the IPC to replace former president Denny McGuirk.
Indium Corp., Dr. Ron Lasky

Lead-Free Assembly: Can We Achieve Consensus?
Dr. Ron Lasky, senior technologist with Indium, discusses with Technical Editor Pete Starkey whether it will ever be possible to reach a consensus on lead-free assembly. He also comments on some practical benefits and explores some reliability issues.
Indium Corp., Ning-Cheng Lee

Into the Future of Solder Materials
Ning-Cheng Lee of Indium and Guest Editor Jennie Hwang discuss lead-free solder development at Indium, as well as the future requirements of lead-free materials.
Isola, Rich Pangier

Isola Introduces Four New Products
Rich Pangier, Director of OEM Marketing at Isola, discusses the company's new products being introduced at IPC APEX EXPO 2012 with Editor Ray Rasmussen.
Maskless Lithography, Rich Chenoweth

An Advanced Photoresist Exposure System
Maskless Lithography's new exposure unit allows extremely fine line and very fast exposure of dry film photoresist. It is compatible with all standard resists, therefore it is not necessary to use an LDI formulation. Additionally, the well-engineered and solidly built unit makes it suitable for virtually any environment. Maskless Lithography's Global VP of Sales and Marketing Rich Chenoweth takes the viewer through a full demonstration of the unit, inside and out.
Mentor Graphics - Valor Division, Mark Laing

Valor Automates Product Planning With New Module
Mark Laing explains why Mentor's Valor division decided to release the new Product Planning Module, and he discusses some of the common production challenges this module addresses.
Mentor Graphics, Michael Ford

Mentor Takes DFM to the Next Level
Michael Ford of Mentor Graphics discusses the DFM paper he presented at IPC APEX EXPO, and Mentor's move to unite the entire process, from design through final assembly.
MicroCraft, Lino Sousa

Re-defining Flying Probe Testing
MicroCraft introduced their brand-new EMMA E4M6151 flying probe tester at IPC APEX EXPO. Guest Editor Pete Starkey chats with MicroCraft President Lino Sousa, who demonstrates the machine's ability to test a 36,000-test-point board in less than eight minutes.
MuTracx, Stuart Hayton

Understanding New Product Introduction
MuTracx has been in inkjet product development mode for nearly three years. With the successful installation of its first machine two weeks ago, the company is entering a new growth phase. Global Sales and Marketing Director Stuart Hayton discusses the long, strange trip that is NPI--and where his company will be headed in the near future.
Nordson Asymtek, Peter Bierhuis

Nordson Asymtek on Precision Dispensing
The last time Peter Bierhuis spoke with Real Time with... and Technical Editor Pete Starkey he was President of Nordson MARCH. Now President of Nordson ASYMTEK, Bierhuis gives his view on the company and how it addresses the market for precision dispensing, both technical and geographic.
Orbotech, Ben Quarles

InSight "the in thing"
Guest interviewer Stuart Hayton speaks to Ben Quarles, Orbotech's Software Solutions Business Manager, about InSight, the latest addition to their suite of front-end products.
P. Kay Metal, Dan Feinberg, Larry Kay

Dredging Through the Dross With MS2
PK Metal has a renowned history of helping those who use soldering processes clean and reuse their dross. President Larry Kay and Vice President Dan Feinberg explain how their products rejuvenate metal considered waste by some.
Photo Stencil, William E. Coleman

Stencil Design Guidelines Update
Dr. William Coleman, recent recipient of the IPC's President's Award, talks to guest editor Kelly Dack about the history of the IPC-7525 stencil design guidelines spec, what is included and how it has recently changed with the times.
Rehm Thermal Systems, Michael Hanke

Rehm Thermal Systems, Technica Partner in U.S
Rehm Thermal Systems has entered into a new U.S. distribution agreement with Technica. Chief Customer Officer Michael Hanke discusses his company's new partnership, and also delves into the family-owned business's focus on process technology and global manufacturing strategy.
Rochester Institute of Technology, Prof. S. Manian Ramkumar

RIT Investigates Anisotropic Adhesive Technology
Professor S. Manian Ramkumar, Professor and Director of Rochester Institute of Technology's Center for Electronics Manufacturing and Assembly describes the mission of the center and shares his research on a novel and very promising anisotropic adhesive technology for assembly.
Sensible Micro Corporation, Chris Torrioni

Are There Fake Parts in Everything?
A recent study discovered that 40% of components supplied to the US government were either substandard or fake. Guest Editor Stuart Hayton chats with Sensible Micro President Christopher Torrioni about how the introduction of the NDAA 2012 will help phase out the fakes.
Spectrum Assembly, Inc., Wally Johnson

Cables and Boards and Box Builds, Oh My!
Spectrum Assembly's Vice President of Sales and Marketing, Wally Johnson, explains his company's niche in helping surrounding companies "tie their loose ends" with regard to cabling and board assemblies.
Vern Solberg Consultancy , Vern Solberg

Embedded Technology and Printed Electronics
Vern Solberg is chair of the newly formed IPC-7092 Committee, charged with establishing the necessary infrastructure to enable commercialization of embedded components. It is important for the IPC printed electronics committees to develop a strong appreciation for NextGen technologies such as those being discussed in IPC-7092. One reason, as discussed by Vern, is that ultimately, embedded components will be integrated with printed electronics-based components, requiring interaction between the IPC committees.
Walt Custer, Custer Consulting

Market Outlook
Industry market guru Walt Custer offers his insight into the markets for electronic products. Turmoil around the globe has some markets in decline or flat while others, driven by certain segments, are growing. Download the slides Walt refers to in this interview here.
Zestron, Sal Sparacino, Umut Tosun

Latest Developments in Aqueous Flux Removal
Zestron launched two new flux removal products at IPC APEX EXPO. Technical Marketing Manager Sal Sparacino, and Application Technology Manager Umut Tosun explain their characteristics and benefits to Technical Editor Pete Starkey.
iNEMI, Bill Bader

iNEMI Update with CEO Bill Bader
iNEMI initiatives continue to help pull the industry forward. Projects focused on medical electronics, miniaturization, and the environment lead the organization's efforts in 2012 along with continued roadmapping efforts.
Business
2BG Solar, James Garner

Of the Solar Industry and Standards: 2BG's View
James Garner of 2BG Solar chats with Guest Editor Bob Neves about his company's unique view of the solar industry, the issues influencing it, and future growth. Garner also examines standards and how they will ultimately help drive down the cost of manufacturing.
Four Agreements at Work, David Dibble

The Four Leadership Agreements
Does the quest for profit blind our leaders to what really keeps companies growing? Industry management guru David Dibble offers a new perspective--new agreements--on leadership. Find out how embracing four ideals can help your company reinvigorate its leadership.
I-Connect007, Mark Thompson

We're Looking for a Few Good Guest Editors
Guest Editor and PCBDesign007 columnist Mark Thompson explains how much he's benefited from being a guest editor for I-Connect007 Real Time events. If you're interested in being a guest editor, and you think you can work well in front of the camera, we'd love to hear from you.
IGT, Nancy Sarmento

Supplier Fit: A Matter of Perspective
Special Events Editor Kelly Dack meets up with fellow Northern Nevadan, Nancy Sarmento, a senior commodity specialist for International Game Technology. Nancy and Kelly discuss supplier fit from prototyping and volume production perspectives. Nancy also gives her impressions of the Women in Electronics session she attended at IPC APEX EXPO and what she's seeing on the show floor.
Spectrum Assembly, Inc., Wally Johnson

Cables and Boards and Box Builds, Oh My!
Spectrum Assembly's Vice President of Sales and Marketing, Wally Johnson, explains his company's niche in helping surrounding companies "tie their loose ends" with regard to cabling and board assemblies.
Steve Williams - Panel Discussion

The State of American Manufacturing
Steve Williams moderates a panel discussion on the state of manufacturing in America, including some facts and figures that put the history of American manufacturing in perspective. Panelists include Dan Beaulieu of D.B. Management Group and Burkle CEO Richard Crowe, who discuss where the industry goes from here, and whether American PCB shops can make a comeback.
Total Parts Plus, Peter Robinson

Data Collection for Environmental Compliance
Peter Robinson discusses his paper on the moving target that is data collection for environmental compliance. Topics addressed include how companies underestimate the task, the quality of data, and the on-going process of data collection within environmental compliance.
Events
Andy Shaughnessy, Kelly Dack and Mark Thompson

IPC APEX EXPO Post-Show Wrap-up
In this post-show wrap-up, Editors Andy Shaughnessy, Mark Thompson and Kelly Dack discuss the successful switch of IPC APEX EXPO from Las Vegas to San Diego, the conference classes and some of the coolest new technologies they've seen during the show. Plus, learn why they're renting an even bigger sailboat next year.
I-Connect007, Steve Gold

Real Time with...IPC's Free iPad Winners Picked
Real Time with...IPC's sponsors are the most generous companies in the industry, giving iPads to numerous lucky attendees. Watch as Steve "Seacrest" Gold notifies some of the lucky winners--and find out what service excellence really means!
Koh Young Technology, Inc., Thorsten Niermeyer

Achieving Consistent Process Quality
Thorsten Niermeyer, Global Sales Director for Koh Young Technology Inc., explains how his company has integrated measurement systems and printing in one closed loop to achieve the ultimate optimization and a consistent process quality.

IPC APEX EXPO 2012 Ribbon-Cutting Ceremony
Minutes after keynote speaker William Shatner finished a very entertaining speech, the IPC APEX EXPO show floor opened with a traditional ribbon-cutting ceremony. Attendees gyrated to the theme from "Star Trek" while waiting to get in.
IPC Update
2-18 Committee Chair, Jorgen Vos

Standardizing the LCA Transfer Process
Jorgen Vos, co-chair of 2-18 Committee, examines his paper on life cycle assessment and the need for standardizing the LCA information transfer process.
2-18b Task Group, Aidan Turnbull/Mark Frimann

2-18b Task Group: Amendments on the Horizon
Aidan Turnbull and Mark Frimann sit down with Guest Editor Krista Crotty to discuss the reasons behind IPC-1752A and the amendments coming for the materials declaration standard.
Alberi EcoTech, Krista Crotty

IPC 2-18 Committee Supplier Declarations
Krista Crotty, Chief EcoGeek of Alberi EcoTech, discusses the 2-18 committee and its activities involving supplier declaration standards. Krista explains the need for standards to assist companies with meeting the requirements of product environmental compliance.
DDi Corporation, Mikel Williams

Mikel Williams' Government Relations Update
DDi Corporation CEO Mikel Williams joins Editor Andy Shaughnessy to discuss his work as Chairman of the IPC Government Relations Committee. He recently spoke on a panel in Washington, D.C. about the importance of using American companies to manufacture military weaponry.
IPC Gvmt. Relations, Bhawnesh Mathur & Fern Abrams

IPC Addresses Conflict Minerals
IPC Board and Government Relations Committee member Bhawnesh Mathur and IPC's Fern Abrams talk about the issues facing the industry regarding conflict minerals.
IPC, Greg Munie

Why Your Technical Papers Matter
Greg Munie discusses the Technical Conference portion of the IPC APEX EXPO, as well as how IPC chooses the winners for the best technical papers being presented at the conference. One of the things he pointed out is that the two best papers highlight some of the key issues the industry is facing today: pad cratering and thermally challenging PCBs.
IPC, Jack Fisher

New IPC Roadmap Reflects Current Challenges
Jack Fisher, Chairman of the IPC Roadmap, joins Editor Andy Shaughnessy to discuss the latest version of the IPC Roadmap. The updated document, available now, features expanded sections on technologies such as embedded passives.
IPC, Marc Carter

Road to Completion: 2011 IPC Technology Roadmap
Marc Carter discusses the recent completion of the 2011 IPC Technology Roadmap and the effort to begin the 2013 version. Industry-wide participation is key to crafting a roadmap that benefits the industry supply chain worldwide.
IPC, Sharon Starr

IPC's Starr Provides Economic Outlook
Sharon Starr, IPC Market Research Director, joins Guest Editor Dan Feinberg to provide a broad, yet detailed, update on the state of the electronics industry. Starr advises that even though we've entered the show season, the industry is showing signs of economic improvement.
IPC, Steve Pudles

New IPC Board Chair Sets Sights on Future
Steve Pudles, CEO of Spectral Response, is the new chairman of the IPC Board of Directors. Steve has served the IPC in a variety of volunteer positions. His goals as chairman are to expand membership in IPC and continue to foster IPC standards throughout the electronics industry. Currently, the IPC Board is interviewing candidates for president of the IPC to replace former president Denny McGuirk.
IPC, Tony Hilvers

Tony Hilvers Discusses IPC APEX in San Diego
Tony Hilvers discusses IPC APEX EXPO 2012 and its move to San Diego. The show has seen great attendance thus far, 15% up over last year, with 1700 workshop attendees and more than 1000 technical conference registrants. IPC has other initiatives as well with small regional trade shows and conferences on a global basis.
PTC, Kelly St. Andre

2-18g Committee Starts on Batteries Declaration
Kelly St. Andre, director of product management for PTC's Product Analytics, discusses the newly formed IPC 2-18g committee and its work on creating a battery declaration standard, including how to get involved with standards development work.
TTM Technologies, Lee Wilmot

IPC-1758 Standard Published
TTM Technologies' Lee Wilmot, co-Chair of the 2-18f Committee, joins Guest Editor Krista Crotty to discuss the publication of the latest section within the 175x series of Supplier Declaration Standards.
Printed Electronics
Caledon Controls Ltd, Michael DuBois

Caledon Controls' Printed Electronics Portfolio
Michael DuBois of Caledon Controls gives us a glimpse of a printed electronics product designed to showcase the technology's benefits. Caledon Controls will be offering this product as the backplane for a portfolio of printed electronics products - lighting, solar, and medical. This is one more indication that the supply chain for the emerging field has matured.
Conductive Compounds, Don Banfield

Printed Electronics Steering Committee Update
Don Banfield is the right person to lead the IPC Printed Electronics Steering Committee. He has been active in the field since the 1980s and has observed first-hand the hype and reality of PEC. As the chairman of the committee, he has staffed it with the individuals who can provide the structure to establish IPC as a leader in the development of the printed electronics ecosystem.
Cookson Electronics, Gene Kim

Roadmaps Offer Edge Against the Competition
Gene Kim discusses Cookson Electronics' participation in the development of printed electronics roadmaps, which offer an advantage over the competition. Roadmaps provide direction and discipline during technology development. Emerging technologies, such as printed electronics, will continue to benefit from roadmaps developed by materials leader Cookson Electronics.
Delphi, Christine Coapman

Printed Electronics and "Green" at Delphi
Christine Coapman provides insight into the printed electronics strategy at Delphi. One attribute of great interest to the company is its "green" nature, which can be used to reduce the carbon footprint necessary for the manufacture of the automotive electronics module or component. Additionally, it can enable improved fuel efficiency by allowing the design of lighter-weight electronics.
DuPont, Scott Gordon

Scott Gordon on DuPont's 40 years in PEC
Scott Gordon provides insight into 40 years of printed electronics at DuPont, a global provider of many essential components for printed electronics, such as functional inks, substrates, and printing consumables. Healthy growth is projected for the future with the introduction of a variety of printed electronics-based applications.
FLEXcon, Stephen D. Tomas

FLEXcon: A Printed Electronics Survivor
FLEXcon is considered by many to be the company that succeeded in solving the printed electronics traffic jam that blocked the way to the commercialization launchpad. Over the past 10 years, the company has launched several product platforms based on roll-to-roll printed electronics. Steve Tomas provides a glimpse into the future of printed electronics at FLEXcon, and in the industry overall.
IPC, Marc Carter

Creating an Ecosystem: Printed Electronics
IPC has several new initiatives that will facilitate the creation of the printed electronics ecosystem: standards, roadmap and steering committee. Marc Carter is the architect of the strategy to deliver the tools necessary to support an emerging industry and through IPC, has reached out to printed electronics subject matter experts to populate the committees which have the greatest chance for success.
MacDermid, Neil Bolding

A Vision for Printed Electronics
People come into contact with membrane switches multiple times a day. Neil Bolding is a veteran of the membrane switch industry, having successfully launched hundreds of products over the past 25 years. His first-hand experience and deep appreciation for printed electronics will enable future growth of the emerging field as he co-leads the recently formed IPC Printed Electronics Steering Committee.
NPES, Debbie Orf

NPES Embraces Printed Electronics
Debbie Orf of NPES, The Association for Suppliers of Printing, Publishing and Converting Technologies, discusses the organization's work with manufacturers of printed electronics. NPES stakeholders have been monitoring the progress of printed electronics as it has moved from the lab (beaker and pipettes) to the fab (printing facility). Key for printed electronics during this move is the deep appreciation for hardware/software platforms and work flow processes unique to printing. NPES stakeholders can provide these critical assets. As part of its strategy, NPES will be engaging with IPC to develop standards and roadmaps to enable its stakeholders to assist in the establishing of the printed electronics ecosystem.
Nippon Mektron, Dr. Matsumoto

Nippon Mektron Prepares for New Products
Nippon's Dr. Matsumoto provides a glimpse of several printed and flexible electronics products that the company has been developing. His company has established a robust supply chain of printed electronic materials suppliers to ensure new product introduction success. Nippon Mektron, a 40-year old company, is excited about the potential of printed electronics products opportunities and actively pursuing them.
Oak-Mitsui, John Andresakis

Printed Electronics Gaining Steam
Oak-Mitsui's John Andresakis talks about the recent developments and technology trends in printed electronics (PE), and how IPC is addressing industry needs by creating standards and specifications particular to PE. He also introduces a coax cable that is as thin as a single strand of hair.
Taiyo America, Josh Goldberg

Printed Electronics Specs on the Way
The materials for printed electronics have changed drastically from simple silver ink and polyester. Josh Goldberg, Marketing Specialist for Taiyo America, gives an overview of how printed electronics are changing, insight into the newly formed D60 series committee, and the development of specifications for these materials in a new age.
Verdant Electronics, Joe Fjelstad

Printed Electronics: Only the Beginning
Joe Fjelstad recently published the 4th edition of his internationally recognized book, "Flexible Circuit Technology." He says he included a chapter for printed electronics because he believes that certain product attributes can only be achieved using the technology. Continued improvement in functional inks, substrates, and manufacturing equipment will lead to a portfolio of printed electronics based products, including lighting, renewable energy, and sensors.
Vern Solberg Consultancy , Vern Solberg

Embedded Technology and Printed Electronics
Vern Solberg is chair of the newly formed IPC-7092 Committee, charged with establishing the necessary infrastructure to enable commercialization of embedded components. It is important for the IPC printed electronics committees to develop a strong appreciation for NextGen technologies such as those being discussed in IPC-7092. One reason, as discussed by Vern, is that ultimately, embedded components will be integrated with printed electronics-based components, requiring interaction between the IPC committees.
Vistana, Chris Miller

Printed Electronics is Key for Vistana
Vistana is a pivotal provider of materials to the printed electronics industry and its growth during the past three years is linked to its continued improvement in performance and expansion of materials options. The company is assisting IPC in the development of important standards for printed electronics growth and sustainability.
iNEMI, Bill Bader

Emerging Technologies and Roadmaps
iNEMI has had a large flexible electronics chapter in its roadmap since 2007. We will see in 2013 the release of the 4th edition of the chapter. A committee to draft the roadmap chapter was formed in 2006 after iNEMI stakeholders identified flexible and printed electronics as an emerging field that would impact medical, aerospace, and automotive industries. Bill Bader explains.