Real Time With... IPC Midwest 2009
Video Index

BBG has been making steady progress through the downturn and has recently added long-time PCB pro, Greg Meindl, to manage sales in Illinois, Indiana and Wisconsin.

This subcommittee is tasked with developing test methods specifically for evaluating high-speed/high-frequency boards and materials. Don DeGroot talks about a breakthrough in the group's efforts to provide a comprehensive test solution.

The team at Calumet Electronics have taken the bull by the horns and developed the systems necessary to capture more business in a tough market. Stephen Marshall, National Sales Manager, talks about the strategic investments the company has made and their approach to capture new business and how they take care of their current customers.

When the latest revision of IPC-9252 was released in November '08, the document moved from a "Guideline" to a "Requirement". Listen to Mike Hill, Committee Chairman, as he discusses the new revision and its implications for the industry.

Designed as a benchmarking tool, the PCQR2 allows board fabricators to assess their capabilities using a common set of tests and tools.

Mahnke provides a progress report on the D-15 committee which is designing test methods for flex materials.

DDI introduced Flat Wrap Technology two years ago to address important via plating concerns on the PCB surface. Chief Technology Officer Raj Kumar discusses the progress his company has made with this technology aimed at helping PCB designers eliminate surface plating issues.

Tulkoff explains the test methods and solutions that help ensure PCB quality relating to moisture absorption.

Dielectric Solutions has developed a new glass system which promises to eliminate many of the headaches associated with traditional glass structures for laminates.

This committee is responsible for assessing design, material, performance and test method needs of the printed board industry in terms of boards utilizing embedded component devices. David McGregor, Committee Chair, gives us an update on their progress.

Veteran PCB technologist Jack Fisher updates us on the latest progress with the roadmapping efforts at IPC.

IPC just released a new design document: IPC-2152, "Standard for Determining Current-Carrying Capacity In Printed Board Design." Ten years in the making, the principal author, Mike Jouppi, discusses the features in the new document and why it's important, if not critical, for PCB designers and engineers.

A rough draft of this committee's latest test methods is now available. Jason Ferguson discusses the current committee status and the process used for developing the test methodologies.

The primary focus of this subcommittee is to improve base material performance and processing consistency via industry-accepted and user-friendly standards and test methods.

Tom Bresnan, vice chair of the High-Speed/High-Frequency Committee, explains how the committee supports manufacturers who use high-speed or high-frequency materials. As end-customers increasingly require high-speed materials, more and more volunteers are getting involved with D-20.

While most have "hunkered down" R&D has been growing, investing in technology and preparing for the impending upturn.

The military industry continues to struggle with lead-free. Vern Solberg talks about some of the issues facing the defense industry and how it will have to adapt going forward.

Although the transition from HASL to RoHS might sound easy, it isn't. Listen to Al Wasserzug as he explains some of things to consider as you make the move to a RoHS-compliant surface finish.

The military has assigned an Executive Agent for the PCB industry. What are implications of this for the PCB industry?

Al Wasserzug discusses the planning process for the up-coming executive meeting, what's on the agenda and the value for PCB executives.

Karl Seelig and Fern Abrams discuss the efforts of the Solder Products Value Council, along with some new challenges being pushed onto the industry regarding the origin of raw materials.

Through organizations like the IPC, the electronics industry can develop the foundation for environmental compliance. John Ciba, Director Facilities, Environmental and Safety Engineering for the Brady Corporation talks about some of the initiatives which will help improve the way the industry responds and complies with old and new regulations.

Werner Engelmaier, "Mr. Reliability," discusses his paper presentation in detail with EMS007's Steve Gold.

The Independent Distributors of Electronics Association works to educate its customers on ways to avoid the dangers of counterfeit components, a problem that's estimated to cost OEMs billions of dollars each year.

The IPC Electronic Industry Executive Summit is scheduled for October 21-22 in Scottsdale, Arizona. IPC's Sharon Starr, Director of Market Research and Susan Filz, Director of Industry Programs explain how the summit will provide PCB and EMS industry leadership with insights into the latest technologies and most critical markets.

The ECD standard (IEC 62430) specifies requirements and procedures to integrate environmental aspects into design and development processes. It provides a framework of ECD requirements and provides a level of alignment with emerging international regulations that will require an ECD process.

Keith Howell discusses the role that the interfacial intermetallic plays with different solder alloys.

With the move to HDI, more and more microvia failures are rearing their ugly heads. Paul Reid talks about some of the root causes for these failures and some solutions.

Professor Subbarayan talks about Purdue University's efforts to understand the failure mechanisms for different lead-free solders.

Leo Reynolds, longtime industry veteran and EMS provider, talks about what it takes to create and sustain a high-performance business environment.

Denny Fritz describes the efforts of the Pb-Free Electronics Risk Management Consortium, a group formed by the aerospace and defense industries to tackle the critical issues surrounding lead-free.

The Product Assurance Committee is working to develop standards and guidelines in support of OEMs and their suppliers.

With a new revision about to hit the street, Mark Frimann, committee co-chair, discusses the major changes incorporated into the new document.

Karl Seelig and Fern Abrams discuss the efforts of the Solder Products Value Council, along with some new challenges being pushed onto the industry regarding the origin of raw materials.

This subcommittee is tasked with developing test methods specifically for evaluating high-speed/high-frequency boards and materials. Don DeGroot talks about a breakthrough in the group's efforts to provide a comprehensive test solution.

The team at Calumet Electronics have taken the bull by the horns and developed the systems necessary to capture more business in a tough market. Stephen Marshall, National Sales Manager, talks about the strategic investments the company has made and their approach to capture new business and how they take care of their current customers.

DDI introduced Flat Wrap Technology two years ago to address important via plating concerns on the PCB surface. Chief Technology Officer Raj Kumar discusses the progress his company has made with this technology aimed at helping PCB designers eliminate surface plating issues.

Werner Engelmaier, "Mr. Reliability," discusses his paper presentation in detail with EMS007's Steve Gold.

The Independent Distributors of Electronics Association works to educate its customers on ways to avoid the dangers of counterfeit components, a problem that's estimated to cost OEMs billions of dollars each year.

IPC just released a new design document: IPC-2152, "Standard for Determining Current-Carrying Capacity In Printed Board Design." Ten years in the making, the principal author, Mike Jouppi, discusses the features in the new document and why it's important, if not critical, for PCB designers and engineers.

With the move to HDI, more and more microvia failures are rearing their ugly heads. Paul Reid talks about some of the root causes for these failures and some solutions.

Tom Bresnan, vice chair of the High-Speed/High-Frequency Committee, explains how the committee supports manufacturers who use high-speed or high-frequency materials. As end-customers increasingly require high-speed materials, more and more volunteers are getting involved with D-20.

Leo Reynolds, longtime industry veteran and EMS provider, talks about what it takes to create and sustain a high-performance business environment.

Denny Fritz describes the efforts of the Pb-Free Electronics Risk Management Consortium, a group formed by the aerospace and defense industries to tackle the critical issues surrounding lead-free.

The military has assigned an Executive Agent for the PCB industry. What are implications of this for the PCB industry?

In addition to a conference and exhibition, IPC Midwest featured the A-Line, a live assembly line – from bare board through assembled circuit board. Greg Papandrew discusses BBG’s role in the A-Line: providing the sample circuit board.

IPC has co-joined two conferences the week of November 9-12. Speakers will address the ongoing and ever-changing environmental issues facing the industry, as well as materials compliance issues that electronics manufacturers must master to build the products of tomorrow.