Real Time With... IPC Midwest 2008
Video Index

Bare Board Group’s Greg Papandrew talks about changes in the Chinese cost structure, the US market climate and how to sell successfully in this market.

It's no secret that PCBs are viewed by most purchasers as commodities. Calumet Sales Manager Stephen Marshall explains how his company is educating buyers about how their new product development circuit design issues can be solved through superior fabricator engineering efforts.

Guest Editor Bob Neves of MicroTek interviews Joel Yocom of Conductive Inkjet Technology. Joel discusses the emergence of UV curable catalyst inks, and explains how they will impact printed electronics, flexible circuits and RFID technology in the future.

Graham Naisbitt is managing director of the UK-based test equipment maker Gen3 Systems, named for the three generations of his family who have worked there. Graham and Bob Neves of Microtek discuss the company’s efforts in testing for solderability, CAF and SIR, as well as Graham’s work on the SIR standard committees for IEC and IPC.

Tom Bresnan, sales manager with R&D Circuits, updates us on the efforts of the High-Speed/High-Frequency Committee at the IPC. Tom also talks about his company’s recent acquisition, along with its business model for building boards with very high aspect ratio holes.

IPC President Denny McGuirk offers his perspective on this year's Midwest Conference and Exhibition. He also touches on what is in store for IPC moving forward, including plans for continued globalization.

Khurrum Dhanji is vice president of Imagineering, a Chicago-area PCB firm. The IPC Midwest attendee sits down with Steve Gold and gives his market perspective--along with some ideas of what companies like his need to do to remain competitive.

Guest Editor Bob Neves of Microtek interviews Doug Sober of Kaneka, an IPC Hall of Famer who chairs the IPC base materials committee. Doug discusses the committee’s recent work to incorporate halogen-free specifications into the 4101 standard, as well as IPC’s work with JEDEC on a joint standard.

Founding partner Marc Chason discusses why Quantum Solar Group was formed and its plans to help the PCB and assembly industries identify opportunities in this very high-growth market.

Guest Editor Bob Neves holds a reliability roundtable discussion with "Mr. Reliability" Werner Engelmaier and Stephen Marshall, national sales manager for Calumet Electronics. When all is said and done, what do we mean by reliability anyway, and what can we do to achieve it?

IPC 7094 standard is ready for publication. Listen to Vern discuss this content changes for this important standard. Vern also discusses the new standard 7093 which focuses on SON/QFN.

Most industry insiders believe RoHS and the lead-free movement have had more detrimental than positive effects. Dr. Ron Lasky, however, discusses some of the benefits lead-free soldering has reaped.

Solder alloy issues like copper dissolution and surface finish compatibility must be addressed. Dr. Ning-Cheng Lee of Indium Corporation discusses some of the work his company doing in the area of solder alloy R&D.

The demand for reliability in electronics manufacturing continues to grow. Tom Forsythe, VP of Kyzen Corp., explains the reliability issues his company faces, and how Kyzen works to educate customers and industry.

After years of no-clean technology, board cleaning is back in the spotlight again, thanks to the move to lead-free. Guest Editor Bob Neves and Doug Pauls, a materials and process engineer with Rockwell Collins, discuss the efforts of the IPC Cleaning and Coating Committee and the relationship between cleanliness and reliability.

The new REACH legislation from the EU will have a dramatic affect on the industry as OEMs drive reporting requirements down through the Supply Chain. John Fox, Business Development Director for Synapsis Technology discusses REACH, some misconceptions and how OEMs are responding to it.

Gary Ferrari, a technical specialist with Firan Technology Group (FTG), is the leader of two design standards committees. He discusses what work each committee is doing, and why their respective missions are so important to the industry.

IPC Director of Technology Transfer Dieter Bergman explains how the still-unreleased Compass software will revolutionize how IPC standards are used by designers. The heart of Compass is a powerful search engine that can scan IPC standards for key words. Bergman expects Compass to be ready by next spring, in time for IPC Expo.

Bare Board Group’s Greg Papandrew talks about changes in the Chinese cost structure, the US market climate and how to sell successfully in this market.

International trade lawyer Lawrence Friedman explains why companies that do international business face greater legal risk, as well as greater rewards. For instance, US companies importing through a fellow NAFTA country like Mexico can save several percent in duties. But failure to pay the correct duty can cost you a fine of triple the duty, or more.

It's no secret that PCBs are viewed by most purchasers as commodities. Calumet Sales Manager Stephen Marshall explains how his company is educating buyers about how their new product development circuit design issues can be solved through superior fabricator engineering efforts.

Guest Editor Bob Neves of MicroTek interviews Joel Yocom of Conductive Inkjet Technology. Joel discusses the emergence of UV curable catalyst inks, and explains how they will impact printed electronics, flexible circuits and RFID technology in the future.

Gary Ferrari, a technical specialist with Firan Technology Group (FTG), is the leader of two design standards committees. He discusses what work each committee is doing, and why their respective missions are so important to the industry.

Tom Bresnan, sales manager with R&D Circuits, updates us on the efforts of the High-Speed/High-Frequency Committee at the IPC. Tom also talks about his company’s recent acquisition, along with its business model for building boards with very high aspect ratio holes.

IPC 7094 standard is ready for publication. Listen to Vern discuss this content changes for this important standard. Vern also discusses the new standard 7093 which focuses on SON/QFN.

Neal Bender, Sharon Starr, Susan Filz discuss the changes in member benefits. IPC members will now automatically receive all market data and studies usually reserved for members of the Executive Forum. In addition, IPC will be making PPT presentations from conferences available to all IPC members.

IPC Director of Technology Transfer Dieter Bergman explains how the still-unreleased Compass software will revolutionize how IPC standards are used by designers. The heart of Compass is a powerful search engine that can scan IPC standards for key words. Bergman expects Compass to be ready by next spring, in time for IPC Expo.

The IPC has an ambitious schedule of educational events for the industry this Fall. Jean Hebeisen outlines the upcoming events for our viewers. Conferences include: HDI Technology Conference, Designers Day, IPC/SMTA Cleaning Symposium,IPC-9592 Conference, IPC Test and Inspection Technology Conference, IPC/JEDEC Conference on Lead-Free.

IPC President Denny McGuirk offers his perspective on this year's Midwest Conference and Exhibition. He also touches on what is in store for IPC moving forward, including plans for continued globalization.

IPC Market Research Director Sharon Starr discusses what current market data might mean to an industry that depends on stable credit markets for capital equipment investment. She also touts an upcoming Orlando conference and explains how it might help industry executives better equip themselves for future growth opportunities.

Khurrum Dhanji is vice president of Imagineering, a Chicago-area PCB firm. The IPC Midwest attendee sits down with Steve Gold and gives his market perspective--along with some ideas of what companies like his need to do to remain competitive.

Most industry insiders believe RoHS and the lead-free movement have had more detrimental than positive effects. Dr. Ron Lasky, however, discusses some of the benefits lead-free soldering has reaped.

Solder alloy issues like copper dissolution and surface finish compatibility must be addressed. Dr. Ning-Cheng Lee of Indium Corporation discusses some of the work his company doing in the area of solder alloy R&D.

The demand for reliability in electronics manufacturing continues to grow. Tom Forsythe, VP of Kyzen Corp., explains the reliability issues his company faces, and how Kyzen works to educate customers and industry.

Motorola has been reducing its environmental footprint for many years. The company’s efforts in “lean-green” manufacturing are akin to its Six Sigma efforts to drive waste out of its business processes. Bill Olson talks about the company’s efforts to build more sustainable products.

Alan Rae chaired the Reuse, Recycling and End-of-Life session. He provides an overview of the session along with some of the highlights, including the challenges facing the industry’s efforts to build sustainability into its products.

Founding partner Marc Chason discusses why Quantum Solar Group was formed and its plans to help the PCB and assembly industries identify opportunities in this very high-growth market.

Guest Editor Bob Neves holds a reliability roundtable discussion with "Mr. Reliability" Werner Engelmaier and Stephen Marshall, national sales manager for Calumet Electronics. When all is said and done, what do we mean by reliability anyway, and what can we do to achieve it?

The new REACH legislation from the EU will have a dramatic affect on the industry as OEMs drive reporting requirements down through the Supply Chain. John Fox, Business Development Director for Synapsis Technology discusses REACH, some misconceptions and how OEMs are responding to it.

Information and Communication Technology (ICT) is transforming the world, bringing people together like never before. Alcatel-Lucent is working to transform this technology into a more sustainable and energy-efficient technology going forward.

Allenby challenges the industry to avoid focusing too much on “sustainability,” and instead understand the total impact of electronic products on the global community, most of which is very good.

As part of NIST, the Chicago Manufacturing Center is tasked with bringing sustainable manufacturing practices to small businesses in the Chicago area.

Dr. Lauren Heine, the senior science advisor with the non-governmental organization Clean Production Action, believes her group and manufacturers want the same thing. The debate centers on how to arrive at that objective. She discusses the pros and cons of “dirty” products that help provide a good quality of life.

The fastest and most effective way to change the industry is to use market drivers. Organizations like EPEAT are working with government and industry to develop incentives to accelerate the adoption of sustainable systems for electronic products.

Intel has been working to eliminate lead and most halogen materials from its semiconductor packages. Hamid Azimi discusses this effort along with other materials initiatives the company is working on.

Intel has been working to integrate more environmentally “friendly” materials into its semiconductor product packages. Part of this effort is being driven by customers, but a lot is being driven by internal efforts to become a more “green” company.

iNEMI has developed the Roadmap for Solid State Illumination (SSI) and Photovoltaics (PV). Chason discusses the reason for this effort and explains how SSI and PV impact sustainability.

Motorola has been reducing its environmental footprint for many years. The company’s efforts in “lean-green” manufacturing are akin to its Six Sigma efforts to drive waste out of its business processes. Bill Olson talks about the company’s efforts to build more sustainable products.

Alan Rae chaired the Reuse, Recycling and End-of-Life session. He provides an overview of the session along with some of the highlights, including the challenges facing the industry’s efforts to build sustainability into its products.

Dr. Handwerker has worked with industry for years as the chief of metrology at NIST in the development of the alloys used in lead-free solders. As a materials engineer, she is working with industry to create sustainable materials for the products of the future.

As the corporate sustainability director and leader, Katie Hunt is leading the charge at Rohm and Haas to develop the materials necessary for a more sustainable industry.

Mike Toben chaired a session on materials at the iNemi Sustainability Summit. He details the highlights of the session, and explains how true sustainability is all about interactions. Some materials – e.g., silver – can be “green” and at the same time not sustainable.

Mandy Hale discusses some of the recycling issues facing product developers, as well as those related to printed circuit boards and assemblies.

Environmental law expert Holly Evans explains how market drivers often have a bigger influence on the greening of the electronic industry than legal drivers. She also discusses efforts to quantify the environmental benefits provided by not-so-green electronics devices that may save energy in the long run.

The US Environmental Protection Agency is working with businesses to develop programs to recycle used electronic equipment. Chris Newman discusses some of the programs the EPA has developed in support of this effort.

Many of the materials used for the products of the future will likely be constructed using nanomaterials. With these new materials comes great opportunity, along with a new set of problems.

iNemi CEO Jim McElroy and VP of Operations Bob Pfahl discuss the 2-day Sustainability Summit and outcomes/recommendations from the break-out groups.